Structure of a lead-frame matrix of photoelectron devices

ABSTRACT

A structure of a lead-frame matrix of photoelectron devices is provided. The lead-frame matrix is used to fabricate a first lead-frame array and a second lead-frame array. In the structure of the lead-frame matrix of the photoelectron devices, pins of the first lead-frame array and pins of the second lead-frame array are alternatively inserted.

RELATED APPLICATIONS

This application is a continuation of application Ser. No. 11/510,661,filed Aug. 28, 2006 which claims priority to Taiwan Application SerialNumber 95115945, filed May 4, 2006, the disclosure of both theapplication Ser. No. 11/510,661 and Taiwan Application Serial Number95115945 are hereby incorporated by reference herein in its entirety.

BACKGROUND

1. Field of Invention

The present invention relates to a structure of a lead-frame matrix ofphotoelectron devices. More particularly, the present invention relatesto a structure of a lead-frame matrix of photo couplers.

2. Description of Related Art

Because of huge amount of consumption of photoelectron devicesmass-manufactured by numerous producers, the price of photoelectrondevices is getting cheaper and it is more difficult to generate profitfrom photoelectron devices. The production cost control of photoelectrondevices is therefore very important for manufacturers to generate profitfrom photoelectron devices in such cheap price. The major cost ofproducing photoelectron devices is material. Therefore, there is a needto reduce the material cost of photoelectron devices in order toincrease profit.

SUMMARY

It is therefore an aspect of the present invention to provide astructure of a lead-frame matrix of photoelectron devices, which canreduce the production cost of photoelectron devices and thus increasethe profit thereof. Moreover, because the production cost is reduced,the price of photoelectron device can be cheaper.

In accordance with the foregoing and other aspects of the presentinvention, a structure of a lead-frame matrix of photoelectron devicesis provided. The structure of a lead-frame matrix of photoelectrondevices comprises a first lead-frame array and a second lead-framearray. Both the first lead-frame array and the second lead-frame arrayare located on the lead-frame matrix of photoelectron devices. Pins ofthe first lead-frame array and pins of the second lead-frame array arealternatively inserted.

In accordance with the foregoing and other aspects of the presentinvention, a structure of a lead-frame matrix of photo couplers isprovided. The structure of a lead-frame matrix of photo couplerscomprises a transmitter lead-frame array and a receiver lead-framearray. Both the transmitter lead-frame array and the receiver lead-framearray are located on the lead-frame matrix of photo couplers. Pins ofthe transmitter lead-frame array and pins of the receiver lead-framearray are alternatively inserted. In the preferred embodiment,transmitter sides of the transmitter lead-frame array and receiver sidesof the receiver lead-frame array are also alternatively inserted.

In accordance with the foregoing and other aspects of the presentinvention, a structure of a lead-frame matrix of infrared remote controlreceiver modules is provided. The structure of a lead-frame matrix ofinfrared remote control receiver modules has a first lead-frame array ofinfrared remote control receiver modules and a second lead-frame arrayof infrared remote control receiver modules. Both the first lead-framearray of infrared remote control receiver modules and the secondlead-frame array of infrared remote control receiver modules are locatedon the lead-frame matrix of infrared remote control receiver modules.Pins of the first lead-frame array of infrared remote control receivermodules and pins of the second lead-frame array of infrared remotecontrol receiver modules are alternatively inserted.

In conclusion, the insertion structure of a lead-frame matrix ofphotoelectron devices can increase the lead-frame density of thelead-frame matrix. The space of the lead-frame matrix can be wellutilized. Therefore, the waste of the lead-frame matrix is reduced.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are included to provide a furtherunderstanding of the invention, and are incorporated in and constitute apart of this specification. The drawings illustrate embodiments of theinvention and, together with the description, serve to explain theprinciples of the invention. In the drawings,

FIG. 1 is a structural drawing of a lead-frame matrix of photo couplersaccording to a preferred embodiment of the invention;

FIG. 2 is a structural drawing of a light transmitter/receiverlead-frame according to a preferred embodiment of the invention;

FIG. 3 is a structural drawing of a lead-frame matrix of lighttransmitters/receivers according to a preferred embodiment of theinvention; and

FIG. 4-5 are structural drawings of a lead-frame matrix of infraredremote control receiver modules according to a preferred embodiment ofthe invention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

The major cost of producing photoelectron devices is material cost.Therefore, the invention helps to reduce the material cost in order toreduce the overall cost of producing photoelectron devices. In thefollowing, photo couplers, light transmitters/receivers and infraredremote control receiver modules are used as examples to illustrate theconcept of the invention. However, the invention is not limited to thesephotoelectron devices. The concept of the invention can be employed toother photoelectron devices.

Photo Coupler

A photo coupler comprises mainly a transmitter side and a receiver side.A light-emitting element on the transmitter side of the photo coupleremits a light signal and a light-receiving element on the receiver sidereceives the light signal. The light-emitting element generally is alight emitting diode (LED). The light-receiving element can be a photodiode, a photo transistor or a light-receiving integrated circuit (IC).

FIG. 1 is a structural drawing of a lead-frame matrix of photo couplers100 according to a preferred embodiment of the invention. In FIG. 1, thelead-frame matrix of photo couplers 100 has multiple rows of transmitterlead-frame arrays 110 and multiple rows of receiver lead-frame arrays120. Each transmitter lead-frame array 110 comprises multipletransmitter lead-frames 111. Each transmitter lead-frame 111 comprises atransmitter side 112, two transmitter pins 114 and a light-emittingelement 116 on the transmitter side 112. Each receiver lead-frame array120 comprises multiple receiver lead-frames 121. Each receiverlead-frame 121 comprises a receiver side 122, two receiver pins 124 anda light-receiving element 126 on the receiver side 122.

In FIG. 1, transmitter lead-frame arrays 110 and receiver lead-framearrays 120 are located side by side on the lead-frame matrix of photocouplers 100. The transmitter sides 112 of the transmitter lead-framearrays 110 are adjacent to the receiver sides 122 of the receiverlead-frame arrays 120. The transmitter pins 114 of the transmitterlead-frame arrays 110 are adjacent to the receiver pins 124 of thereceiver lead-frame arrays 120. The transmitter sides 112 of thetransmitter lead-frame arrays 110 and the receiver sides 122 of thereceiver lead-frame array 120 are alternatively inserted. Thetransmitter sides 112 can be fit into the space between two adjacentreceiver sides 122, and the receiver sides 122 can be fit into the spacebetween two adjacent transmitter sides 112. The transmitter pins 114 ofthe transmitter lead-frame arrays 110 and the receiver pins 124 of thereceiver lead-frame array 120 are alternatively inserted. Thetransmitter pins 114 can be fit into the space between two adjacentreceiver pins 124, and the receiver pins 124 can be fit into the spacebetween two adjacent transmitter pins 114. In this structure of thelead-frame matrix of the embodiment of FIG. 1, the space of thelead-frame matrix can be utilized well and efficiently. Therefore, thewaste of the lead-frame matrix is reduced and the production cost isthus reduced.

In another embodiment, in order to utilize the space of the lead-framematrix even more efficiently, the transmitter sides 112 can be fit intothe space between two adjacent receiver sides 122 and even connected tothe receiver lead-frame array 120, and the receiver sides 122 can beconnected to the transmitter lead-frame array 110 in the same way as thetransmitter sides 112. Similarly, the transmitter pins 114 can also beconnected to the receiver lead-frame array 120, and the receiver pins124 can be connected to the transmitter lead-frame array 110. In thisstructure of the lead-frame matrix, more lead-frames can be produced ona lead-frame matrix with higher density of lead-frames. Half morelead-frames than what available on traditional lead-frame matrix can beproduced based on the structure of the lead-frame matrix of theinvention

Light Transmitter/Receiver

In the embodiment of photo couplers, the lead-frame of photo couplercomprises transmitter lead-frame and receiver lead-frame. Therefore,these two types of lead-frames are produced on the lead-frame matrix. Inthe embodiment of light transmitter/receiver, there is only one type oflead-frames, transmitter lead-frame or receiver lead-frame, need to beproduced on the lead-frame matrix. The structure of the transmitterlead-frame is similar to that of the receiver lead-frame. Thetransmitter lead-frame and the receiver lead-frame are distinguishedfrom photoelectron elements displaced thereon. In the transmitterlead-frame, the photoelectron element displaced thereon is alight-emitting element. In the receiver lead-frame, the photoelectronelement displaced thereon is a light-receiving element.

FIG. 2 is a structural drawing of a light transmitter/receiverlead-frame according to a preferred embodiment of the invention. Thelight transmitter/receiver lead-frame 300 comprises atransmitter/receiver side 310 and two transmitter/receiver pins 320. Alight emitting/receiving element is placed on the transmitter/receiverside 310.

FIG. 3 is a structural drawing of a lead-frame matrix of lighttransmitters/receivers 400 according to a preferred embodiment of theinvention. In order to explain the concept of the invention clearly,transmitter/receiver lead-frame arrays with different arrangementdirection are named temporarily as a first transmitter/receiver array410 and a second transmitter/receiver array 420. In fact, the firsttransmitter/receiver array 410 is totally the same as the secondtransmitter/receiver array 420.

The first transmitter/receiver array 410 has multiple firsttransmitter/receiver pins 416. Similarly, the secondtransmitter/receiver array 420 also has multiple secondtransmitter/receiver pins 426. The first transmitter/receiver pins 416and the second transmitter/receiver pins 426 are alternatively inserted.The first transmitter/receiver pins 416 can be fit into the spacebetween two adjacent second transmitter/receiver pins 426 to fill thespace and to connect to the second transmitter/receiver array 420. Thesecond transmitter/receiver pins 426 can be fit into the space betweentwo adjacent first transmitter/receiver pins 416 to fill the space andto connect to the first transmitter/receiver array 410.

Infrared Remote Control Receiver Module

FIG. 4-5 are structural drawings of a lead-frame matrix of infraredremote control receiver modules 200 according to a preferred embodimentof the invention. In FIG. 4, the lead-frame matrix of infrared remotecontrol receiver modules 200 before being cutting is shown. In order toexplain the concept of the invention clearly, lead-frame arrays ofinfrared remote control receiver modules with different arrangementdirection are named temporarily as a first lead-frame array of infraredremote control receiver modules 210 and a second lead-frame array ofinfrared remote control receiver modules 220. In fact, the firstlead-frame array of infrared remote control receiver modules 210 istotally the same as the second lead-frame array of infrared remotecontrol receiver modules 220.

The first lead-frame array of infrared remote control receiver modules210 has multiple first modular functional areas 212, multiple firstmodular locating holes 214, multiple first modular pins 216 and multiplefirst modular lenses 218 on the first modular functional areas 212. Thefirst modular locating holes 214 are used for locating the lead-framematrix when producing the infrared remote control receiver modules. Thefirst modular lenses are used for infrared ray to pass through them totrigger photoelectron elements on the first modular functional areas212. Because the second lead-frame array of infrared remote controlreceiver modules 220 is the same as the first lead-frame array ofinfrared remote control receiver modules 210, the second lead-framearray of infrared remote control receiver modules 220 also has multiplesecond modular functional areas 222, multiple second modular locatingholes 224, multiple second modular pins 226 and multiple second modularlenses 228.

The first lead-frame array of infrared remote control receiver modules210 and the second lead-frame array of infrared remote control receivermodules 220 are alternatively inserted. The first modular pins 216 canbe fit into the space between two adjacent second modular pins 226 tofill the space and to connect to the second lead-frame array of infraredremote control receiver modules 220. The second modular pins 226 can befit into the space between two adjacent first modular pins 216 to fillthe space and to connect to the first lead-frame array of infraredremote control receiver modules 210.

In FIG. 5, the lead-frame matrix of infrared remote control receivermodules 200 after being cutting is shown. In FIG. 5, the firstlead-frame array of infrared remote control receiver modules 210 and thesecond lead-frame array of infrared remote control receiver modules 220are cut apart. Meanwhile, the Is first modular locating holes 214 andthe second modular locating holes 224 are also cut away from the firstlead-frame array of infrared remote control receiver modules 210 and thesecond lead-frame array of infrared remote control receiver modules 220.Finally, the first lead-frame array of infrared remote control receivermodules 210 and the second lead-frame array of infrared remote controlreceiver modules 220 can be used to form infrared remote controlreceiver modules.

Accordingly, the present invention has the following advantages.

(1) The structure of the lead-frame matrix of photoelectron devices ofthe invention can reduce the production cost and thus generate profitfrom photoelectron devices. Moreover, because the production cost islowered, the price of photoelectron device can be even cheaper.

(2) In the structure of the lead-frame matrix of photoelectron devicesof the invention, more lead-frames can be produced on a lead-framematrix with higher density of lead-frames. Half more lead-frames thanwhat available on traditional lead-frame matrix can be produced based onthe structure of the lead-frame matrix of the invention.

The preferred embodiments of the present invention described aboveshould not be regarded as limitations to the present invention. It willbe apparent to those skilled in the art that various modifications andvariations can be made to the present invention without departing fromthe scope or spirit of the invention. The scope of the present inventionis as defined in the appended claims.

1. A lead-frame matrix for photo-electronic devices, comprising: areceiver lead-frame array, comprising receiver lead-frames laterallyconnected to form a first row, each receiver lead-frame having two freepins and a free side; and a transmitter lead-frame array, comprisingtransmitter lead-frames laterally connected to form a second rowsubstantially parallel to the first row, each transmitter lead-framehaving two free pins and a free side, wherein each of the free receiversides and each of the free transmitter sides are mutually spaced with adistance and each of the free receiver sides and the each of thetransmitter sides are arranged transversely inwardly.
 2. The lead-framematrix according to claim 1, wherein the free sides of the receiverlead-frames and the free sides of the transmitter lead-frames arearranged in a row.
 3. The lead-frame matrix according to claim 1,further comprising a light-emitting element disposed on each of the freesides of the receiver lead-frames and a light-receiving element disposedon each of the free sides of the transmitter lead-frames and eachlight-emitting element and each light-receiving element facing upwardly.